Photosensitive solder resist ink, printed circuit board and production thereof
US5821031A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1996 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | May 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink. The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt % of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in a diluent; (C) a photopolymerization initiator; and (D) a diluent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.