Frame for manufacturing encapsulated semiconductor devices
US5821607A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 8, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Jan 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reusable metal frame for manufacturing of encapsulated semiconductor devices includes a metal sheet having a plurality of openings disposed in compliance with topology of semiconductor devices carried by a supporting structure. During the molding operation, the frame is superposed over the supporting structure with each semiconductor device to be encapsulated, positioned centrally within one of the openings. The encapsulating material (resin, plastic, or the like) is supplied to each semiconductor device and stays within each opening, held in place by continuous uninterrupted contour of each opening. After the encapsulating material has been cooled, the metal frame is readily removed, and may be used in other molding operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.