ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
25Patents
6Active
25Granted
31Portfolio score
Filing activity: Jan 8, 1997 → Mar 23, 2021 · 2 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7948772B2 | Memory card with electrostatic discharge protection and manufacturing method thereof | Emerging Cross-Sectional Technologies | 24 | Active |
| USD647097S1 | Memory card | General | 21 | Expired |
| USD647096S1 | Memory card | General | 14 | Expired |
| US6677185B2 | Method of affixing a heat sink to a substrate and package thereof | Electricity | 5 | Expired |
| US7115978B2 | Package Structure | Electricity | 4 | Expired |
| US6499648B2 | Method and device for making a metal bump with an increased height | Electricity | 4 | Expired |
| US6847111B2 | Semiconductor device with heat-dissipating capability | Electricity | 3 | Expired |
| US7576418B2 | Lead frame structure and applications thereof | Electricity | 3 | Active |
| US6358834B1 | Method of forming bumps on wafers or substrates | Electricity | 3 | Expired |
| US6567270B2 | Semiconductor chip package with cooling arrangement | Electricity | 2 | Expired |
| US6608391B1 | Preparation method of underfill for flip chip package and the device | Electricity | 2 | Expired |
| US6521484B1 | Mold injection method for semiconductor device | Electricity | 1 | Expired |
| US6033934A | Semiconductor chip fabrication method and apparatus therefor | Electricity | 1 | Expired |
| US11355356B1 | Manufacturing method of semiconductor package comprising heat spreader | Electricity | 1 | Active |
| US11462454B2 | Semiconductor package comprising heat spreader and manufacturing method thereof | Electricity | 0 | Active |
| US6577151B1 | Inspection device for wiring of an integrated circuit | Electricity | 0 | Expired |
| US6274491A | Process of manufacturing thin ball grid array substrates | Electricity | 0 | Expired |
| US6600216B1 | Structure of a pin platform for integrated circuit | Electricity | 0 | Expired |
| US6274883A | Structure of a ball grid array substrate with charts for indicating position of defective chips | Electricity | 0 | Expired |
| US7394147B2 | Semiconductor package | Electricity | 0 | Expired |
| US8627577B2 | Apparatus of checking dimensions of memory card | Physics | 0 | Active |
| US11462485B2 | Electronic package including electromagnetic shielding structure and method of manufacture | Electricity | 0 | Active |
| US6260611A | Heat dissipation module | Electricity | 0 | Expired |
| US6390356B1 | Method of forming cylindrical bumps on a substrate for integrated circuits | Electricity | 0 | Expired |
| US5821607A | Frame for manufacturing encapsulated semiconductor devices | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.