Method and apparatus for detecting shorts in a multi-layer electronic package
US5821759A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Feb 27, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/52
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for locating shorts in multi-layer electronic packages during manufacture allows repair of the shorts and improved yields of the packages. A multi-layer package is fitted in a fixture after forming a thin film layer of metalization, and test is performed to detect shorts in the package. If a short is detected, a low current, high frequency signal is injected in pins on a bottom surface of the package. An approximate two dimensional location of the short is sensed by detecting an electromagnetic force induced by a magnetic field inductively coupled to a sensor proximate to the short on a top surface of the multi-layer package. The approximate location of the short is then inspected to precisely locate the short.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.