Card type memory device and a method for manufacturing the same
US5822190A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1997 |
| Grant date | Oct 13, 1998 |
| Priority date | — |
| Expiry date | Jun 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external terminal electrode sections with a step section formed between the bed section and the external terminal electrode section, the bed sections of the metal frame being electrically connected to the external terminal electrode sections of the semiconductor chip. At least one surface and outer peripheral surface of the semiconductor chip are resin sealed such that at least electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with a resin-sealed body surface. By doing so, a semiconductor package is formed. The semiconductor package is buried in a recess in a card type base board such that the electrode surfaces of the external terminal electrode sections of the metal frame in the semiconductor package is buried substantially flush with an external surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.