Method for manufacturing a semiconductor device
US5824177A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Jul 12, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer, which can be divided into chips at a high yield and a low cost and easily handled during transfer thereof as well, is disclosed. In a semiconductor wafer of such structure that structures with a low mechanical strength, such as suspended microstructures, are exposed at a surface thereof, detachable adhesive sheet making up protective caps for the respective suspended microstructures are formed over the semiconductor wafer. By means of this, even if the semiconductor wafer is diced into the individual chips, respective microstructures on chips are protected from the external force, such as the pressure of cutting water, during the dicing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.