Fumio Ohara
9Patents
6h-index
20Co-inventors
59Inventor score
Filing activity: Jan 22, 1991 → Jan 30, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6555901B1 | Semiconductor device including eutectic bonding portion and method for manufacturing the same | Electricity | 310 | Expired |
| US5668033A | Method for manufacturing a semiconductor acceleration sensor device | Emerging Cross-Sectional Technologies | 157 | Expired |
| US5824177A | Method for manufacturing a semiconductor device | Emerging Cross-Sectional Technologies | 88 | Expired |
| US6072240A | Semiconductor chip package | Electricity | 69 | Expired |
| US6448645B1 | Semiconductor device | Electricity | 39 | Expired |
| US5483097A | Device protecting layer | Electricity | 6 | Expired |
| US5470618A | Method of making zinc-based transparent conductive film | Chemistry; Metallurgy | 5 | Expired |
| US7556510B2 | Mounting structure of connector and method for mounting connector on substrate | Emerging Cross-Sectional Technologies | 4 | Active |
| US5153700A | Crystal-etched matching faces on semiconductor chip and supporting semiconductor substrate | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.