Tape carrier and assembly structure thereof
US5825081A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Oct 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is characterized by providing leads not contributing to actual connection outside the corner leads to prevent the deformation of the corner leads and improve the yield of tape carriers. A device hole is made in a near-central place of an insulating resin film. Around the device hole, outer-lead holes are made. On the insulating resin film, a plurality of wiring patterns are provided and forced to project into the device hole. The plurality of wiring patterns are formed into a plurality of inner leads, of which the outermost ones are determined to be corner leads. On each corner of the device hole, an aligning mark is provided. Dummy leads are provided closer to the aligning marks. The dummy leads are made shorter than the inner leads and corner leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.