Eiichi Hosomi
27Patents
12h-index
27Co-inventors
77Inventor score
Filing activity: Sep 22, 1995 → Sep 11, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5801447A | Flip chip mounting type semiconductor device | Electricity | 94 | Expired |
| US6111317A | Flip-chip connection type semiconductor integrated circuit device | Electricity | 91 | Expired |
| US6159837A | Manufacturing method of semiconductor device | Electricity | 77 | Expired |
| US5631499A | Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics | Electricity | 77 | Expired |
| US6740981B2 | Semiconductor device including memory unit and semiconductor module including memory units | Electricity | 76 | Expired |
| US6469373B2 | Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor | Electricity | 41 | Expired |
| US5773888A | Semiconductor device having a bump electrode connected to an inner lead | Electricity | 38 | Expired |
| US5747881A | Semiconductor device, method of fabricating the same and copper leads | Electricity | 37 | Expired |
| US5825081A | Tape carrier and assembly structure thereof | Electricity | 32 | Expired |
| US6376907B1 | Ball grid array type package for semiconductor device | Electricity | 30 | Expired |
| US6049130A | Semiconductor device using gold bumps and copper leads as bonding elements | Electricity | 20 | Expired |
| US7087988B2 | Semiconductor packaging apparatus | Electricity | 14 | Expired |
| US6768206B2 | Organic substrate for flip chip bonding | Electricity | 12 | Expired |
| US7531751B2 | Method and system for an improved package substrate for use with a semiconductor package | Electricity | 10 | Expired |
| US6551854B2 | Semiconductor device having bump electrodes and method of manufacturing the same | Electricity | 3 | Expired |
| US7817439B2 | System and apparatus for power distribution for a semiconductor device | Electricity | 3 | Active |
| US7910956B2 | Semiconductor device with interface circuit and method of configuring semiconductor devices | Emerging Cross-Sectional Technologies | 3 | Active |
| US7492570B2 | Systems and methods for reducing simultaneous switching noise in an integrated circuit | Electricity | 2 | Expired |
| US7227260B2 | Method and system for a pad structure for use with a semiconductor package | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6061466A | Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads | Electricity | 2 | Expired |
| US6960494B2 | Semiconductor package and method of manufacturing the same | Electricity | 1 | Expired |
| US8183599B2 | Semiconductor device with interface circuit and method of configuring semiconductor devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US5615822A | Method and apparatus for controlling bonding load of fine lead electrode | Electricity | 0 | Expired |
| US9153510B2 | Semiconductor device and method of manufacturing the same | Electricity | 0 | Active |
| US6836012B2 | Semiconductor package and method of manufacturing the same | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.