Low thermal resistance semiconductor package and mounting structure
US5825088A · kind A · utility
7Cited by
8References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 24, 1993 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Mar 24, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic package and mounting structure which requires less surface area on a heat sink and improves heat transfer to the heat sink. Each ceramic package has a top side and a bottom side with the bottom side being flat and smooth. The bottom side can be a polished ceramic, or a metal layer which is plated or brazed to the bottom side. The mounting structure includes a clamp in pressure engagement with the top side of the package and maintains the package pressure engagement with the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.