Low thermal resistance spring biased RF semiconductor package mounting structure
US5825089A · kind A · utility
12Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Oct 20, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic package and mounting structure which requires less surface area on a heat sink and improves heat transfer to the heat sink. Each ceramic package has a top side and a bottom side with the bottom side being flat and smooth. The bottom side can be a polished ceramic, or metal layer which is plated or brazed to the bottom side. The mounting structure includes a clamp and a spring in pressure engagement with the top side of the package for maintaining the package in pressure engagement with the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.