J-lead conditioning method and apparatus
US5826630A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1997 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Sep 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device package lead conditioning method and system corrects bowed-in J-leads (36) of an electronic device package (30) by inserting between a bowed-in J-lead (36) and electronic device package (36) a comb-like tooth (42) having a graduating-width edge, the graduating width edge graduating from a minimum width (112) to a maximum width (114). The minimum width permits the graduating width edge (112) to be inserted into a space (110) separating the bowed-in J-lead (36) from electronic device package (30). The maximum width (114) at least equals the width of a desired spacing for the bowed-in J-lead (36) from the electronic device package (30) for correcting for the bowed-in-condition of the bowed-in J-lead (36).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.