Low temperature method for evacuating and sealing field emission displays
US5827102A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 1996 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | May 13, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for evacuating and sealing a field emission display package and an improved field emission display package are provided. The field emission display package includes a face plate, a back plate and a peripheral seal formed between the face plate and back plate of a low melting point seal material such as indium or an alloy of indium. Within the sealed package components of a field emission display are mounted. These include a display screen formed on the face plate and a base plate flip chip mounted to the face plate. The peripheral seal is formed during a sealing and evacuating process performed in a reaction chamber at a reduced pressure. During the sealing and evacuating process the seal material is compressed. In addition, the sealing and evacuating process can be performed at approximately room temperature or alternately at temperature near the softening point of the seal material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.