Socket assembly for integrated circuit chip carrier package
US5829988A · kind A · utility
76Cited by
17References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Nov 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.