Method for producing multi-layer circuit board and resulting article of manufacture
US5830374A · kind A · utility
6Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Sep 5, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a layer of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of selecting a core material from one of three iron/nickel alloys, namely either (i) 58% Fe/42% Ni; (ii) 60% Fe/39% Ni/1% Cu; or (iii) 60% Fe/38.7% Ni/0.12% Mn/0.07% Si; forming the core material into a panel suitable for an intended application; cleaning the panel in preparation for plating; plating the panel with copper; subjecting the plated panel to heat treatment; and circuitizing the panel as appropriate for the intended application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.