Christina M. Boyko
22Patents
14h-index
40Co-inventors
77Inventor score
Filing activity: Mar 14, 1990 → May 13, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6775907B1 | Process for manufacturing a printed wiring board | Emerging Cross-Sectional Technologies | 105 | Expired |
| US5450290A | Printed circuit board with aligned connections and method of making same | Emerging Cross-Sectional Technologies | 98 | Expired |
| US6931726B2 | Method of making and interconnect structure | Emerging Cross-Sectional Technologies | 87 | Expired |
| US6214525A | Printed circuit board with circuitized cavity and methods of producing same | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6121069A | Interconnect structure for joining a chip to a circuit card | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6015520A | Method for filling holes in printed wiring boards | Electricity | 41 | Expired |
| US5571593A | Via fill compositions for direct attach of devices and methods for applying same | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5953623A | Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6212769A | Process for manufacturing a printed wiring board | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5766670A | Via fill compositions for direct attach of devices and methods for applying same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5784782A | Method for fabricating printed circuit boards with cavities | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6066386A | Printed circuit board with cavity for circuitization | Emerging Cross-Sectional Technologies | 16 | Expired |
| US4960634A | Epoxy composition of increased thermal conductivity and use thereof | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6030693A | Method for producing multi-layer circuit board and resulting article of manufacture | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6194024A | Via fill compositions for direct attach of devices and methods for applying same | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5830374A | Method for producing multi-layer circuit board and resulting article of manufacture | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6660945B2 | Interconnect structure and method of making same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US5374338A | Selective electroetch of copper and other metals | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6547974B1 | Method of producing fine-line circuit boards using chemical polishing | Electricity | 4 | Expired |
| US6134772A | Via fill compositions for direct attach of devices and methods of applying same | Emerging Cross-Sectional Technologies | 2 | Expired |
| US5472735A | Method for forming electrical connection to the inner layers of a multilayer circuit board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6776852B2 | Process of removing holefill residue from a metallic surface of an electronic substrate | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.