Packaging method for a ball grid array integrated circuit without utilizing a base plate
US5830800A · kind A · utility
50Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate as a supporting plate, and therefore reducing the thickness of the packaged BGA IC. In the method, a copper sheet is used as a supporting plate first. After resin is applied to coat a chip implanted on the copper sheet and connecting wires thereof has hardened, the hardened resin is sufficiently firm to support the IC, so the copper sheet can be etched. Accordingly, a base plate is not necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.