Integrated junction temperature sensor/package design and method of implementing same
US5831333A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | May 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method for controlling the junction temperature of a semiconductor chip in an electronic system. A temperature sensing device and the chip whose junction temperature is to be monitored are located adjacent to one another on the same interconnect structure. A thermally conductive lid can also be attached to the interconnect structure, thereby enclosing the temperature sensing device and the chip within in a closed cavity. Dedicated pins extend from the temperature sensing device through the interconnect structure, for connection to a temperature control circuit. By locating the temperature sensing device on the same interconnect structure as the chip, and within a common enclosure, the temperature sensed by the temperature sensing device is an accurate representation of the actual junction temperature of the chip. By obtaining an improved reading of the actual junction temperature, the operation of the temperature control circuit can be optimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.