Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device
US5831441A · kind A · utility
35Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1996 |
| Grant date | Nov 3, 1998 |
| Priority date | — |
| Expiry date | Mar 8, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07364
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.