Kunio Kodama
5Patents
4h-index
25Co-inventors
57Inventor score
Filing activity: Jan 27, 1977 → Oct 19, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6218281A | Semiconductor device with flip chip bonding pads and manufacture thereof | Electricity | 102 | Expired |
| US5831441A | Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device | Physics | 35 | Expired |
| US6344407B1 | Method of manufacturing solder bumps and solder joints using formic acid | Electricity | 35 | Expired |
| US5854558A | Test board for testing a semiconductor device and method of testing the semiconductor device | Electricity | 18 | Expired |
| US4190555A | Catalyst system for polymerizing alpha-olefins and method of making same | Chemistry; Metallurgy | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.