Electronic component package with decoupling capacitors completely within die receiving cavity of substrate

US5831810A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Kenneth A. Bird · New Paltz, US
• Peter J. Brofman · Hopewell Junction, US
• Francis F. Cappo · Wappingers Falls, US
• Jason L. Frankel · Beacon, US
• Suresh D. Kadakia · Hopewell Junction, US
• Sarah H. Knickerbocker · Hopewell Junction, US
• Scott A. Sikorski · Cambridge, US

Key dates

• Filing date: Aug 21, 1996
• Grant date: Nov 3, 1998
• Expiry date: Aug 21, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.