Method of modifying conductive lines of an electronic circuit board and its apparatus
US5832595A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1994 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Jun 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49732
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board. Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.