Method of making microwave circuit package
US5832598A · kind A · utility
57Cited by
8References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Nov 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an s! matrix close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.