Material transfer apparatus and method of using the same
US5834062A · kind A · utility
44Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1997 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Sep 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) form cavities (20) that are filled with the material (21). The pins (13) are then extended from the cavity plate (16) to transfer the material (21) from the cavities (20) to the electronic component (32).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.