Curable polyphenylene ether-thermosetting resin composition and process
US5834565A · kind A · utility
68Cited by
29References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | Nov 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0326
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.