Heat treating apparatus
US5834737A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1996 |
| Grant date | Nov 10, 1998 |
| Priority date | — |
| Expiry date | May 6, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is a heat treating apparatus, including a support plate having an object to be treated disposed thereon, heating member for heating the object through the support plate, and support pins extending through the support plate so as to support the object, wherein the support plate is provided with holes each sized large enough to permit a horizontal movement of the support pin, and the support pin is movable in a horizontal direction within the hole made in the support plate. The present invention also is a heat treating apparatus, including a support plate arranged within a treating chamber and having an object to be treated disposed thereon, heating member for heating the object through the support plate, a cover member arranged in the treating chamber to define a treating space between the support plate and the cover member, a shutter member partitioning the treating space and capable of opening/closing the partitioned treating space, and a gap setting member disposed between the cover member and the shutter member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.