Lead frame and semiconductor device
US5837567A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1997 |
| Grant date | Nov 17, 1998 |
| Priority date | — |
| Expiry date | Mar 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.