Copper chemical mechanical polishing slurry utilizing a chromate oxidant
US5840629A · kind A · utility
162Cited by
33References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 14, 1995 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Dec 14, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There is described a slurry for use in chemical mechanical polishing of copper layers in integrated circuit fabrication. The slurry includes a chromate oxidant, such as sodium chromate tetrahydrate (Na.sub.2 CrO.sub.4.4H.sub.2 O). The chromate oxidant provides a slightly basic slurry solution that enhances removal characteristics for copper layers. In one embodiment, the slurry has a pH between about 6 and about 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.