Ball grid array package employing solid core solder balls
US5841198A · kind A · utility
24Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1997 |
| Grant date | Nov 24, 1998 |
| Priority date | — |
| Expiry date | Apr 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array package utilizes solder balls having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package and motherboard assembly are heated to the melting point of the solder material, the cores remain solid and function as spacers in preventing direct contact of the package surface and the motherboard surface, thus preventing molten solder from being squashed and flowing to adjacent ball contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.