Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
US5842628A · kind A · utility
28Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1996 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Apr 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.