Ryuji Nomoto
20Patents
15h-index
35Co-inventors
77Inventor score
Filing activity: Mar 5, 1996 → Mar 22, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5656550A | Method of producing a semicondutor device having a lead portion with outer connecting terminal | Emerging Cross-Sectional Technologies | 267 | Expired |
| US6476503B1 | Semiconductor device having columnar electrode and method of manufacturing same | Electricity | 188 | Expired |
| US6072239A | Device having resin package with projections | Emerging Cross-Sectional Technologies | 161 | Expired |
| US6573121B2 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Emerging Cross-Sectional Technologies | 88 | Expired |
| US6376921B1 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Emerging Cross-Sectional Technologies | 83 | Expired |
| US6329711A | Semiconductor device and mounting structure | Emerging Cross-Sectional Technologies | 81 | Expired |
| US6215182A | Semiconductor device and method for producing the same | Electricity | 80 | Expired |
| US6255740A | Semiconductor device having a lead portion with outer connecting terminals | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6288444A | Semiconductor device and method of producing the same | Electricity | 56 | Expired |
| US7122897B2 | Semiconductor device and method of manufacturing the semiconductor device | Electricity | 49 | Expired |
| US7456089B2 | Semiconductor device and method of manufacturing the semiconductor device | Electricity | 44 | Active |
| US5930603A | Method for producing a semiconductor device | Electricity | 42 | Expired |
| US5842628A | Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method | Electricity | 28 | Expired |
| US6207477A | Semiconductor device having a ball grid array and a fabrication process thereof | Electricity | 21 | Expired |
| US6495773B1 | Wire bonded device with ball-shaped bonds | Electricity | 19 | Expired |
| US6856017B2 | Device having resin package and method of producing the same | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7863745B2 | Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device | Electricity | 4 | Active |
| US7251801B2 | Method of designing circuit board | Electricity | 3 | Expired |
| US9041186B2 | Encapsulated semiconductor chips with wiring including controlling chip and method of making the same | Electricity | 1 | Active |
| US7144754B2 | Device having resin package and method of producing the same | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.