Off-center grooved polish pad for CMP
US5842910A · kind A · utility
46Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Mar 10, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for polishing a semiconductor wafer using a polishing pad. The polishing pad contains circumferential grooves which are located off center from the geometric center of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.