Douglas K. Sturtevant
4Patents
4h-index
11Co-inventors
40Inventor score
Filing activity: Mar 10, 1997 → Jun 30, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5944583A | Composite polish pad for CMP | Performing Operations; Transporting | 68 | Expired |
| US5842910A | Off-center grooved polish pad for CMP | Performing Operations; Transporting | 46 | Expired |
| US5885135A | CMP wafer carrier for preferential polishing of a wafer | Electricity | 23 | Expired |
| US6599173B1 | Method to prevent leaving residual metal in CMP process of metal interconnect | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.