Composition and method for selective plating
US5843517A · kind A · utility
7Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Apr 30, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.