Method for electroless nickel plating of metal substrates
US5843538A · kind A · utility
251Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Nov 14, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1844
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for plating nickel onto metal substrates. The method broadly comprises the steps of passing the metal substrate to be plated through a dilute organic acid bath solution to remove contaminants and other deleterious materials, agitating the bath solution as the metal substrate passes therethrough, and thereafter electrolessly plating nickel on the surfaces of the metal substrate. The method of the present invention may be used to nickel plate substrates formed from steel, copper and aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.