Multichip module with heat sink and attachment means
US5844311A · kind A · utility
7Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Dec 1, 1998 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15312
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coefficient to a substrate 11, is soldered at one surface thereof to that surface of the substrate 11 on which semiconductor devices 12 are mounted. The frame 15 is fastened or fixedly secured at the other surface thereof to a lid member 17 by bolts 10 or means without any heat treatment of the whole of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.