CMP slurry measurement and control technique
US5846398A · kind A · utility
73Cited by
32References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 1996 |
| Grant date | Dec 8, 1998 |
| Priority date | — |
| Expiry date | Aug 23, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Chemical mechanical polishing slurry characteristics, such as oxidant concentration and abrasive particle dispersion, are determined using electrochemical measurement techniques, such as chronoamperometry, amperometry, chronopotentiometry, ionic conductivity, or linear sweep potentiometry. Slurry characteristics may be tested and monitored independent of a CMP polishing tool. Slurry characteristics may also be automatically controlled in an on-line chemical mechanical polishing process using electrochemical measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.