Sputtering device and method for reactive for reactive sputtering
US5849162A · kind A · utility
20Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1995 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | Apr 25, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for reactive sputter coating in a chamber in which large substrates to be coated are transported past one or more coating stations. The stations are comprised of at least one sputtering target and at least one adjacent plasma generator. In the practice of this invention the sputtering and reaction zones within the chamber are indistinguishable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.