Probe apparatus for electrical inspection of printed circuit board assembly
US5850146A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1996 |
| Grant date | Dec 15, 1998 |
| Priority date | — |
| Expiry date | Jul 18, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2806
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe apparatus for the electrical inspection of a printed circuit board (PCB) assembly includes a probe assembly for inspecting the electrical circuitry of a PCB having electronic components mounted thereon. A first driving mechanism is provided for moving the probe assembly rectilinearly, and a guide is provided for guiding the rectilinear movement of the probe assembly. The probe assembly includes a probe tip for making contact with a solder joint on the PCB to detect a signal for the electrical inspection, a force sensor combined with the rear portion of the probe tip for measuring a contact force applied to the probe tip when the probe tip makes contact with the solder joint, a location sensor for measuring the location of the probe tip when in contact with the solder joint, and a device for controlling the location of the probe tip, according to the measured contact force and location thereof. The probe may further include a second driving mechanism for controlling the angle of inclination of the probe assembly to solder joints. Such a probe is improved in adaptability to the various patterns of the solder joints and thus enables stable testing of the PCB, by preventing poo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.