Semiconductor wafer polishing apparatus with a flexible carrier plate
US5851140A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1997 |
| Grant date | Dec 22, 1998 |
| Priority date | — |
| Expiry date | Feb 13, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining ring is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of a vacuum and a source of pressurized fluid alternately to be connected to the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.