Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor
US5854740A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1996 |
| Grant date | Dec 29, 1998 |
| Priority date | — |
| Expiry date | Apr 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit board with one or more semiconductor chips installed thereon, and a manufacturing method therefor, are disclosed. The circuit board with semiconductor chips installed thereon includes: one or more semiconductor chips; an insulated circuit board having wire bonding pads for connection to the bonding pads of the semiconductor chips; a plurality of wires connected between the bonding pads of the semiconductor chips and the wire bonding pads of the circuit board; and a plurality of protecting covers for insulating the wires and the semiconductor chips. The circuit board includes an opening smaller than the semiconductor chips, and wire bonding pads formed around the opening. The semiconductor chip includes bonding pads which are formed on the central portion of the surface of the semiconductor chip. The protective cover covers the chip and the wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.