Gi Bon Cha
11Patents
8h-index
4Co-inventors
61Inventor score
Filing activity: Apr 22, 1992 → May 4, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5444301A | Semiconductor package and method for manufacturing the same | Electricity | 250 | Expired |
| US5428248A | Resin molded semiconductor package | Electricity | 248 | Expired |
| US5363279A | Semiconductor package for a semiconductor chip having centrally located bottom bond pads | Emerging Cross-Sectional Technologies | 76 | Expired |
| US5854740A | Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor | Electricity | 30 | Expired |
| US6030858A | Stacked bottom lead package in semiconductor devices and fabricating method thereof | Electricity | 21 | Expired |
| US5861668A | Semiconductor package | Electricity | 20 | Expired |
| US6242798A | Stacked bottom lead package in semiconductor devices | Electricity | 16 | Expired |
| US5334873A | Semiconductor packages with centrally located electrode pads | Electricity | 11 | Expired |
| US6399420B2 | Ultra high density integrated circuit BLP stack and method for fabricating the same | Electricity | 5 | Expired |
| USRE37413E | Semiconductor package for a semiconductor chip having centrally located bottom bond pads | General | 1 | Expired |
| USRE36097E | Semiconductor package for a semiconductor chip having centrally located bottom bond pads | General | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.