Novolac polymer planarization films for microelectronic structures
US5858547A · kind A · utility
15Cited by
16References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 6, 1994 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Jul 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31667
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved method for forming planarization films which remain adhered to substrates upon exposure to heat comprising first applying a polymeric solution containing a low molecular weight novolac resin, a surfactant selected from the group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof, and an optional organic solvent to a substrate, followed by heating the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.