Image formation utilizing photosensitive compositions containing low metal content p-cresol oligomers
US5858627A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1997 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Aug 29, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0236
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Process for producing a photosensitizer comprising a diazo ester of a p-cresol oligomer where at least one of the hydroxy groups on the p-cresol ring has been esterified with diazo-sulfonyl chloride comprising from about 60 to 100 mole % 2,1,4 or 2,1,5-diazo sulfonyl chloride, or a mixture thereof; and a photoresist comprising an admixture of the photosensitizer, which is present in the photoresist composition in an amount sufficient to uniformly photosensitive the photoresist composition, a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition, and a suitable solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.