Method of bonding IC component to flat panel display
US5858806A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 1996 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Mar 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method wherein an IC component is mounted to electrodes provided in a transparent portion of a flat panel display with interposition of an anisotropic conductive adhesive or film, includes steps of detecting, when mounting the IC component onto the transparent portion of the flat panel display for temporary bonding to the adhesive or film, positional displacement amounts of first positional alignment portions in two positions of the mounted IC component relative to second positional alignment portions in two positions of the transparent portion of the flat panel display in correspondence with the first positional alignment portions by a camera from a side of the flat panel display opposite from a side on which the IC component is mounted, thereby inspecting positional alignment state of bumps of the IC component with the electrodes of the flat panel display, feeding back the positional displacement amount of the IC component with respect to the flat panel display when the positional alignment state is not acceptable, and performing positional alignment of bumps of a next IC component with the electrodes of the flat panel display while taking the fed-back positional displacement a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.