Kazuto Nishida
19Patents
10h-index
34Co-inventors
68Inventor score
Filing activity: Jun 5, 1992 → Oct 6, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7683482B2 | Electronic component unit | Emerging Cross-Sectional Technologies | 50 | Active |
| US6981317B1 | Method and device for mounting electronic component on circuit board | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6086441A | Method for connecting electrodes of plasma display panel | Electricity | 32 | Expired |
| US6926796B1 | Electronic parts mounting method and device therefor | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5917156A | Circuit board having electrodes and pre-deposit solder receiver | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5858806A | Method of bonding IC component to flat panel display | Electricity | 27 | Expired |
| US6156150A | IC component separating method and separating apparatus | Emerging Cross-Sectional Technologies | 23 | Expired |
| US7355126B2 | Electronic parts packaging method and electronic parts package | Electricity | 11 | Expired |
| US5240170A | Method for bonding lead of IC component with electrode | Emerging Cross-Sectional Technologies | 10 | Expired |
| US8007627B2 | Electronic component mounting method and apparatus | Emerging Cross-Sectional Technologies | 10 | Active |
| US7613010B2 | Stereoscopic electronic circuit device, and relay board and relay frame used therein | Emerging Cross-Sectional Technologies | 9 | Active |
| US7060528B2 | Method for mounting a semiconductor element to an interposer by compression bonding | Electricity | 7 | Expired |
| US7090502B2 | Board connecting component and three-dimensional connecting structure using thereof | Electricity | 6 | Expired |
| US5462626A | Method of bonding an external lead and a tool therefor | Electricity | 6 | Expired |
| US6966964B2 | Method and apparatus for manufacturing semiconductor device | Electricity | 4 | Expired |
| US7473476B2 | Soldering method, component to be joined by the soldering method, and joining structure | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7759784B2 | 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules | Electricity | 2 | Active |
| US7771561B2 | Apparatus and method for surface treatment to substrate | Electricity | 1 | Active |
| US7960828B2 | Carrier frame for electronic components and production method for electronic components | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.