Method of treating a semi-conductor wafer
US5858880A · kind A · utility
97Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1996 |
| Grant date | Jan 12, 1999 |
| Priority date | — |
| Expiry date | Jan 5, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of treating a semi-conductor wafer a short-chain polymer is deposited on the wafer to planarise surface features on the wafer and a diffusion layer is deposited on the surface of the polymer layer to allow moisture to be released from the polymer at a controlled rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.