Inventor · Bristol, GB

Christopher Dobson

20Patents
7h-index
16Co-inventors
62Inventor score

Filing activity: Aug 1, 1994 → Mar 8, 2010

Most-cited inventions

PatentTitleAreaCited byStatus
US5874367A Method of treating a semi-conductor wafer Emerging Cross-Sectional Technologies 142 Expired
US5858880A Method of treating a semi-conductor wafer Emerging Cross-Sectional Technologies 97 Expired
US5527561A Method for filing substrate recesses using elevated temperature and pressure Electricity 58 Expired
US5932289A Method for filling substrate recesses using pressure and heat treatment Emerging Cross-Sectional Technologies 36 Expired
US6287989A Method of treating a semiconductor wafer in a chamber using hydrogen peroxide and silicon containing gas or vapor Emerging Cross-Sectional Technologies 29 Expired
US5843535A forming a layer Electricity 14 Expired
US6174823A Methods of forming a barrier layer Electricity 7 Expired
US6169027A Method of removing surface oxides found on a titanium oxynitride layer using a nitrogen containing plasma Electricity 5 Expired
US7698070B2 Method and apparatus for assessing polypeptide aggregation Physics 4 Expired
US7379824B2 Computational method and apparatus for predicting polypeptide aggregation or solubility Physics 4 Expired
US7930157B2 Computational method and apparatus for predicting polypeptide aggregation or solubility Physics 2 Active
US6592770B1 Method of treating an isulating layer Electricity 2 Expired
US6019847A Apparatus for applying pressure to a coated surface of a workpiece Electricity 1 Expired
US6824699B2 Method of treating an insulting layer Electricity 1 Expired
US8155888B2 Method and apparatus for assessing polypeptide aggregation Physics 1 Active
US7309662B1 Method and apparatus for forming a film on a substrate Electricity 1 Expired
US5492737A Deposition apparatus and method Electricity 0 Expired
US8849578B2 Computational method and apparatus for predicting polypeptide aggregation or solubility Physics 0 Active
US6423635B1 Method of filling a recess Electricity 0 Expired
US6274245A Foil for use in filing substrate recesses Emerging Cross-Sectional Technologies 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.