Apparatus for polishing wafers
US5860853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1996 |
| Grant date | Jan 19, 1999 |
| Priority date | — |
| Expiry date | Dec 19, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing wafers comprising a turn table with a polishing pad fixedly extended thereon, at least one polishing head positioned above a point on the turn table spaced by a distance from its center, a plate mounted on a lower surface of the at least one polishing head, and a carrier, which is used for retaining the wafers, mounted on the plate in a manner such that the carrier is freely rotatable relative to the plate, wherein a backing pad which is used to press the wafers is fixed on the plate and the wafers are rotated around their respective centers, while being revolved around the center of the plate. According to the apparatus, polished wafers with an excellent flatness are obtained in a reliable manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.