Device for cathode sputtering
US5863399A · kind A · utility
21Cited by
5References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 1997 |
| Grant date | Jan 26, 1999 |
| Priority date | — |
| Expiry date | Apr 11, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device for cathode sputtering for producing coatings on a substrate 27 by means of a sputtering cathode, which device can be introduced into a vacuum chamber and has magnets or ring magnets 9, 13 concentrically arranged in respect to the center axis 44 of the sputtering cathode, pole shoes 14 and a target 8. The target has a front surface 41 with at least a surface portion which is inclined with respect to the back surface 40 of the target. In the area of the back surface 40 of the target at least one second, outer ring magnet 42 with a larger diameter is provided in addition to the inner ring magnets 9, 13.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.